Semiconductor apparatus

Details Semiconductor apparatus Semiconductor apparatus

2005-11-10

2008-12-09

Chen, Jack (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Reexamination Certificate

active

07462928

ABSTRACT:
A semiconductor apparatus according to the present invention comprises a support member that has a recessed portion, one pair of positive and negative conductive wiring members that are provided on the support member, a semiconductor device that is electrically connected to the conductive wiring members and is disposed in the recessed portion, and a coating member that seals at least the semiconductor device. Side walls of the recessed portion has a first side wall105that surrounds the semiconductor device103, and the second side wall106that protrudes from the first side wall. At least a first wall surface106ain the bottom side of the recessed portion in wall surfaces of the second side wall106is coated with a metallic material. Consequently, a highly reliable semiconductor apparatus with improved light-outgoing efficiency is provided.

REFERENCES:
patent: 3974002 (1976-08-01), Casey et al.
patent: 5920119 (1999-07-01), Tamba et al.
patent: 6667941 (2003-12-01), Kabasawa
patent: 11-74561 (1999-03-01), None
patent: 11074561 (1999-03-01), None
patent: 2004-207672 (2004-07-01), None
patent: 2004228549 (2004-08-01), None

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