Semiconductor component with passivation layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257SE23132, C438S127000, C438S958000

Reexamination Certificate

active

07470993

ABSTRACT:
A semiconductor component has a semiconductor body and also a metal/insulation structure arranged above the semiconductor body and having a plurality of metal regions and insulation regions laterally adjoining one another. The metal regions serve for supplying the semiconductor body with electric current. Furthermore, the semiconductor component has a passivation layer arranged on the metal/insulation structure. The passivation layer includes a metal or a metal-containing compound.

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German Office Action dated Dec. 7, 2006.
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Sauber, John, “Modeling of Die Surface Features on Integrated Circuits to Improve Device Reliability,” Digital Equipment Corporation, pp. 1-14, date unknown.

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