Methods for forming contact hole, for manufacturing circuit...

Details Methods for forming contact hole, for manufacturing circuit... Methods for forming contact hole, for manufacturing circuit...

2006-07-31

2008-12-02

Nhu, David (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S359000, C257S396000, C257S622000, C257SE21007, C257SE21273, C257SE21249, C257SE21309, C257SE21577

Reexamination Certificate

active

07459793

ABSTRACT:
A method for forming a contact hole, a method for manufacturing a circuit board and a method for manufacturing an electro-optical device that increase the reliability of electrical coupling via a conductive part and prevent wire-breaking due to projections when forming a contact hole in an interlayer film by using a needle, and burying a conductive material in the contact hole is provided.

REFERENCES:
patent: 6690004 (2004-02-01), Miller et al.
patent: 6717181 (2004-04-01), Murakami et al.
patent: 6969480 (2005-11-01), Dalton et al.
patent: 7199049 (2007-04-01), Harada et al.
patent: 2005/0181533 (2005-08-01), Kawase et al.
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patent: 10-096960 (1998-04-01), None
patent: 2000-260870 (2000-09-01), None
patent: 2003-127405 (2003-05-01), None
patent: 2000-0076824 (2000-12-01), None
patent: 2003-0035892 (2003-05-01), None
patent: 02/33740 (2002-04-01), None
Communication from Korean Patent Office regarding corresponding application.

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