Method and apparatus for inspecting foreign particle defects

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

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C356S237300, C356S237400

Reexamination Certificate

active

07453561

ABSTRACT:
The invention relates to a device production process for forming a circuit pattern on a substrate such as semiconductor device. To enable a stable inspection of a minute foreign particle and a pattern defect occurring in manufacture of a device at a high speed and with a high sensitivity, an object to be inspected on which a transparent film is formed, is irradiated with a beam which is emitted from an illuminator whose illumination direction and illumination angle are selected from a plurality of choices to be optimum, so that scattered reflected light from a minute foreign particle defect on the object or the transparent film is effectively detected by eliminating a noise from the pattern formed on the object, and a detection optical system is optimized by evaluating and adjusting, with an image forming performance checker, an image forming performance of the detection optical system included in an inspecting apparatus.

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patent: 2004/0095573 (2004-05-01), Tsai et al.
patent: 2005/0052643 (2005-03-01), Lange et al.
patent: 2005/0110987 (2005-05-01), Furman et al.
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patent: 2000-105203 (2000-04-01), None
patent: 2001-060607 (2001-03-01), None

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