Method of determining a flatness of an electronic device...

Details Method of determining a flatness of an electronic device... Method of determining a flatness of an electronic device...

Filed on

2005-04-26

Date issued

2008-11-25

Examiner

Deo, Duy-Vu (Department: 1792)

Patent Class

Etching a substrate: processes

SubClass

Forming or treating mask used for its nonetching function

Other Related Categories

C216S057000, C438S014000, C438S690000

Type

Reexamination Certificate

Status

active

Patent number

07455785

Description

ABSTRACT:
A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as a measured flatness, selecting a load type with reference to the measured flatness, and polishing the substrate under pressure distribution specified by the load type. A principal surface of the substrate has a flatness greater than 0 μm and not greater than 0.25 μm. A polishing apparatus includes a rotatable surface table, a polishing pad formed thereon, abrasive supplying means for supplying an abrasive to the polishing pad, substrate holding means, and substrate pressing means for pressing the substrate. The substrate pressing means has a plurality of pressing members for individually and desirably pressing a plurality of divided regions of the substrate surface.

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