Metal treatment – Process of modifying or maintaining internal physical... – Heating or cooling of solid metal
Reexamination Certificate
2006-02-10
2008-12-02
Wyszomierski, George (Department: 1793)
Metal treatment
Process of modifying or maintaining internal physical...
Heating or cooling of solid metal
C148S712000
Reexamination Certificate
active
07459042
ABSTRACT:
A method (112) of loading an expandable medical device in a low vapor environment. The method includes placing the device in a loading chamber (114) at, for example, room temperature and removing (116) from the chamber any undesirable contaminants such as water vapor that can form condensation on the device when the device is cooled for compression into a transfer tube or delivery catheter. The temperature in the chamber is lowered (118) to a temperature below the transition temperature (martensitic finish) of the device. The device is compressed (120) below its' transition temperature and loaded (122) into a delivery or transfer device.
REFERENCES:
patent: 5554181 (1996-09-01), Das
patent: 6083257 (2000-07-01), Taylor et al.
patent: 6823576 (2004-11-01), Austin
patent: 6837901 (2005-01-01), Rabkin et al.
patent: 2002/0051730 (2002-05-01), Bodnar et al
patent: 2002/0138126 (2002-09-01), Camrud et al.
patent: 2003/0070469 (2003-04-01), Kokish
patent: 2005/0166389 (2005-08-01), Perreault et al.
patent: WO-01/32104 (2001-05-01), None
International Search Report and Written Opinion in PCT/US2006/004886, filed Feb. 10, 2006.
Cook Incorporated
Godlewski Richard J.
Wyszomierski George
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