Mold assembly

Details Mold assembly Mold assembly

Filed on

2006-07-24

Date issued

2008-12-02

Examiner

Gupta, Yogendra (Department: 1791)

Patent Class

Plastic article or earthenware shaping or treating: apparatus

SubClass

With apparatus assembly or dismantling means or with idle part

SubSubClass

For extrusion or injection type shaping means

Other Related Categories

C425S168000, C425S577000, C425S808000, C425S408000

Type

Reexamination Certificate

Status

active

Patent number

07458797

Description

ABSTRACT:
A mold assembly (200) is described that includes an upper mold (4), a lower mold (5) and a plurality of adjusting members (7). The upper mold includes an upper mold core (42). The lower mold includes a lower mold carrier (51) and a lower mold core (52). The lower mold carrier includes a plurality of sidewalls (511), which cooperatively define an opening (512) and have a plurality of screw holes (515) defined therethrough in communication with the receiving cavity. The lower mold core is received in the receiving cavity with a clearance formed therebetween. The adjusting member engages in the screw holes for aligning the lower mold core with the lower mold carrier.

REFERENCES:
patent: 4861254 (1989-08-01), Takeuchi et al.
patent: 4911632 (1990-03-01), Mansfield
patent: 6328552 (2001-12-01), Hendrickson et al.
patent: 7008212 (2006-03-01), Yang
patent: 2006/0286196 (2006-12-01), Chien

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