IC tag and IC tag attachment structure

Details IC tag and IC tag attachment structure IC tag and IC tag attachment structure

2005-12-15

2008-08-26

Lee, Michael G. (Department: 2876)

Registers

Records

Conductive

C340S572800, C340S572700, C343S767000, C257S501000

Reexamination Certificate

active

07416135

ABSTRACT:
A first metal plate for transmission and a second metal plate for transmission are closely-attached to a first surface and a second surface of a dielectric body, respectively. An outer edge of the first metal plate substantially symmetrically faces an outer edge of the second metal plate via the dielectric body. A metal plate for matching is arranged inside a hole formed on the second metal plate, with a slit formed with an inner wall of the hole, and is fixed to the dielectric body. The metal plate for matching is electrically connected to the first metal plate via a through hole penetrating the dielectric body. An IC chip is surface-mounted to connect the second metal plate with the metal plate for matching.

REFERENCES:
patent: 6188368 (2001-02-01), Koriyama et al.
patent: 1339 132 (2003-08-01), None
patent: A-2003-243926 (2003-08-01), None
patent: A-2004-164055 (2004-06-01), None

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