High-heat conductive Si-containing material and its...

Details High-heat conductive Si-containing material and its... High-heat conductive Si-containing material and its...

2006-04-28

2008-10-28

Group, Karl E (Department: 1793)

Compositions: ceramic

Ceramic compositions

Carbide or oxycarbide containing

C264S671000, C264S672000, C264S673000, C264S682000

Reexamination Certificate

active

07442662

ABSTRACT:
A highly heat-conductive Si-containing material containing a Si phase whose lattice constant at room temperature is controlled at a level of more than 0.54302 nm but 0.54311 nm or less. Firing is conducted using a kiln material containing no B compound. With this highly heat-conductive Si-containing material and the process for production thereof, a reduction in heat conductivity can be prevented and a high heat conductivity can be exhibited stably.

REFERENCES:
patent: 4299631 (1981-11-01), Kennedy et al.
patent: 4970057 (1990-11-01), Willkens et al.
patent: 5179049 (1993-01-01), Numata et al.
patent: 5432253 (1995-07-01), Singh
patent: 5589116 (1996-12-01), Kojima et al.
patent: 5846460 (1998-12-01), Matsuura et al.
patent: 6036932 (2000-03-01), Hongu et al.
patent: 6387834 (2002-05-01), Odaka et al.
patent: 6695984 (2004-02-01), Odaka et al.
patent: 6699401 (2004-03-01), Horiuchi et al.
patent: 6699411 (2004-03-01), Odaka et al.
patent: 6737168 (2004-05-01), Yamagata et al.
patent: 7011803 (2006-03-01), Ichikawsa et al.
patent: 2003/0151152 (2003-08-01), Nichelson et al.
patent: 0519644 (1992-12-01), None
patent: 55-109273 (1980-08-01), None
patent: 60-131862 (1985-07-01), None
patent: 60-221380 (1985-11-01), None
patent: 05-017227 (1993-01-01), None
patent: 06-345412 (1994-12-01), None
patent: 10-291857 (1998-11-01), None
patent: 11-214680 (1999-08-01), None
patent: 01-07377 (2001-02-01), None
patent: WO 01/79138 (2001-10-01), None
Derwent Abstract, Japanese document 60131862 A, Jul. 13, 1985.
Derwent Abstract, Japanese document 10291857, Nov. 4, 1998.
Derwent Abstract, Japanese document 55109273, Aug. 22, 1980.
The Japan Institute of Metals, Kinzoku Data Book, revised 2ndedition, Maruzen Co., Ltd., Jan. 30, 1984 (p. 43).

Affiliated with

Also associated with

Rating

High-heat conductive Si-containing material and its... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-heat conductive Si-containing material and its..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-heat conductive Si-containing material and its... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4018373