Drying and gas or vapor contact with solids – Apparatus – With means to treat gas or vapor
Reexamination Certificate
2005-10-27
2008-10-21
Gravini, S. (Department: 3749)
Drying and gas or vapor contact with solids
Apparatus
With means to treat gas or vapor
C034S092000, C134S066000, C118S061000
Reexamination Certificate
active
07437832
ABSTRACT:
A reduced pressure drying apparatus includes a chamber that closes in an airtight manner during a reduced pressure drying operation, a stage on which a substrate is mounted; and an exhaust unit having an exhaust tube that opens at exhaust openings within the chamber. The stage is disposed within the chamber during the reduced pressure drying operation. The exhaust unit discharges atmosphere from the chamber via the exhaust openings during the reduced pressure drying operation to reduce the pressure within the chamber. The exhaust openings are formed such that a position of the exhaust openings is substantially the same as or no higher than a surface position of the substrate. The reduced pressure drying apparatus allows a film having a more uniform thickness to be formed on the substrate.
REFERENCES:
patent: 4771730 (1988-09-01), Tezuka
patent: 4854263 (1989-08-01), Chang et al.
patent: 5520744 (1996-05-01), Fujikawa et al.
patent: 5556500 (1996-09-01), Hasegawa et al.
patent: 5608974 (1997-03-01), Tanaka et al.
patent: 5784799 (1998-07-01), Kato et al.
patent: 6016611 (2000-01-01), White et al.
patent: 6108928 (2000-08-01), Park et al.
patent: 6158141 (2000-12-01), Asada et al.
patent: 6263587 (2001-07-01), Raaijmakers et al.
patent: 6848961 (2005-02-01), Nomura et al.
patent: 6866744 (2005-03-01), Miya et al.
patent: 2001-170546 (2001-06-01), None
patent: 2001-267236 (2001-09-01), None
patent: 2003-75795 (2003-03-01), None
patent: 2003-234273 (2003-08-01), None
patent: 2003-262464 (2003-09-01), None
patent: 2001-0092699 (2001-10-01), None
Global IP Counselors, LLP
Gravini S.
Seiko Epson Corporation
LandOfFree
Reduced pressure drying apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reduced pressure drying apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reduced pressure drying apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4017497