Heat sink electronic package having compliant pedestal

Details Heat sink electronic package having compliant pedestal Heat sink electronic package having compliant pedestal

2006-05-16

2008-10-21

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S715000, C361S719000, C165S080300, C165S185000

Reexamination Certificate

active

07440282

ABSTRACT:
An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The heat sink includes compliant pedestals each having a contact surface for contacting a surface of an electronic device to conduct thermal energy away from the electronic device. The package is held together such that the heat sink is in contact with the surface of an electronic device such that each compliant pedestal applies a compressive force to the surface of the electronic device.

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