Micro-electromechanical probe circuit substrate

Details Micro-electromechanical probe circuit substrate Micro-electromechanical probe circuit substrate

2006-04-26

2008-08-19

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S761010

Reexamination Certificate

active

07414419

ABSTRACT:
A MEMPCS having high stiffness against bending deformation or distortion is formed by integrating the probe, electronic circuit, circuit connecting pad and dielectric material into a complete unit with flexible multiple-layered substrate structure, and the part of the probe extended outside the dielectric material is further wrapped with a protecting layer to form an reinforced structure for increasing high stiffness to the probe and for preventing environmental dirt and particle from getting into the gap existed between the probes of the MEMPCS.

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