Electrolytic bath and methods of use

Details Electrolytic bath and methods of use Electrolytic bath and methods of use

1985-06-28

1987-08-11

Tung, T.

Chemistry: electrical and wave energy

Processes and products

204 431, 204 461, 204 47, 204 475, 204 48, 204 49, 204 521, 204 53, 204 541, 204 551, 204 585, 20412985, 20412995, 427319, C25D 300

Patent

active

046860177

ABSTRACT:
An electrolytic bath, suitable for depositing a metal on or removing a metal from a substrate is provided which comprises an anode and cathode, an acid having a pK.sub.a of about 6 or less, and a chalcogen-containing compound soluble in said bath and having the empirical formula ##STR1## wherein X is a chalcogen, each of R.sub.1 and R.sub.2 is selected from hydrogen, NR.sub.3 R.sub.4 and NR.sub.5, at least one of R.sub.1 and R.sub.2 is other than hydrogen, each of R.sub.3 and R.sub.4 is hydrogen or a monovalent organic radical, and R.sub.5 is a divalent organic radical, in which the molar ratio of the chalcogen compound to the acid is about 1 or more, and the molar ratio of water to the combination of acid and chalcogen compound is about 10 or less. The electrolytic bath enables the use of higher concentrations of strong acids than would otherwise be possible, minimize hydrogen and/or oxygen evolution at the electrodes with attendant advantages, and is useful in a variety of methods such as electroplating (including immersion plating), electroforming, electrolytic machining, electropolishing, electrolytic roughening, anodizing and electrowinning.

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