Nickel/indium alloy and method of using same in the manufacture

Details Nickel/indium alloy and method of using same in the manufacture Nickel/indium alloy and method of using same in the manufacture

1986-06-19

1987-08-11

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

046860150

ABSTRACT:
An improved method of manufacturing printed circuit boards of the type in which a metal clad substrate is covered with a photoresist, the photoresist is masked with a predetermined circuit image, the photoresist is exposed and the exposed photoresist is removed to provide a circuit image on the surface of the metal, the circuit image is electroplated with a metallic etch resist and the remaining photoresist and exposed metal cladding is removed to provide a board having a metal circuit covered by a metallic etch resist, the improvement comprising a metallic etch resist composed of a nickel/indium alloy containing from about 0.1 to about 10 weight percent indium based on the total weight of the alloy.

REFERENCES:
patent: 3673680 (1972-07-01), Tanaka
patent: 4135988 (1979-01-01), Dugan

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