Radiator for semiconductor

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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Details

C165S122000, C165S080300, C361S697000

Reexamination Certificate

active

07441590

ABSTRACT:
A radiator for a semiconductor includes a main body which is provided for radiating heat from the semiconductor mounted to a substrate, and a plate member attached to the main body. The plate member is provided to have an elasticity relative to the substrate. The plate member includes a plate portion that covers a part of one surface of the main body, opposite to the substrate, and four leg portions each of which extends from an outer periphery of the plate portion and is fixed to the substrate. In the radiator, the plate member effectively absorbs stress applied to the substrate.

REFERENCES:
patent: 5597034 (1997-01-01), Barker et al.
patent: 6109340 (2000-08-01), Nakase et al.
patent: 6381836 (2002-05-01), Lauruhn et al.
patent: 6411510 (2002-06-01), Sasa et al.
patent: 6504712 (2003-01-01), Hashimoto et al.
patent: 6538888 (2003-03-01), Wei et al.
patent: 6788536 (2004-09-01), Lai et al.
patent: 7237599 (2007-07-01), Lopatinsky et al.
patent: 7281893 (2007-10-01), Pan
patent: 2003/0024688 (2003-02-01), Dowdy et al.
patent: 1567574 (2005-01-01), None
patent: A-2000-104697 (2000-04-01), None
patent: A-2000-323875 (2000-11-01), None
Office Action dated Feb. 1, 2008 in corresponding Chinese Patent Application No. 2006100069337 (and English translation).

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