Polymer for sealing porous materials during chip production

Details Polymer for sealing porous materials during chip production Polymer for sealing porous materials during chip production

2004-11-12

2008-10-28

Moore, Margaret G (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

C528S028000

Reexamination Certificate

active

07442756

ABSTRACT:
A compound and method for sealing or protecting porous materials used in semiconductor fabrication, and in particular for protecting the inner walls of trenches or recesses or vias which are present in such materials. Specifically, compounds and the method of use of the compounds in which polymer compounds comprising functional groups A and B are used to seal surface-exposed pores in porous materials used in chip production.

REFERENCES:
patent: 4552905 (1985-11-01), Keil et al.
patent: 4576973 (1986-03-01), Keil et al.
patent: 5008153 (1991-04-01), Hayes
patent: 5061739 (1991-10-01), Shimizu
patent: 5252403 (1993-10-01), Blum et al.
patent: 5603985 (1997-02-01), Kent et al.
patent: 5773197 (1998-06-01), Carter et al.
patent: 5882799 (1999-03-01), Roseboom et al.
patent: 2004/0115910 (2004-06-01), Passemard et al.
patent: 4107664 (1992-09-01), None
patent: 2 819 635 (2002-07-01), None
patent: 2819635 (2002-07-01), None
patent: 01149879 (1989-06-01), None
patent: XP 002256549 (1992-03-01), None
patent: 09241532 (1997-09-01), None
patent: 2000154349 (2000-06-01), None
patent: EP 1122278 (2001-08-01), None
patent: EP 1138732 (2001-10-01), None
patent: WO01/54190 (2001-07-01), None

Affiliated with

Also associated with

Rating

Polymer for sealing porous materials during chip production does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polymer for sealing porous materials during chip production, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polymer for sealing porous materials during chip production will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4014310