Structure for mounting electronic component on wiring board

Details Structure for mounting electronic component on wiring board Structure for mounting electronic component on wiring board

2005-05-12

2008-08-05

Norris, Jeremy C. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S257000, C174S260000, C029S829000, C361S748000

Reexamination Certificate

active

07408785

ABSTRACT:
A structure for mounting an electronic component on a wiring board according to the invention includes a wiring board that is provided with wiring patterns, each having a land portion, and an electronic component that has a plurality of electrodes which are soldered to the land portions. Each land portion is made of a first metallic material which is solderable. Further, on each wiring pattern adjacent to each land portion, a second metallic material which is nonsolderable is provided.

REFERENCES:
patent: 6998532 (2006-02-01), Kawamoto et al.
patent: 7142000 (2006-11-01), Eldridge et al.
patent: 2002/0175421 (2002-11-01), Kimura
patent: 2003/0000067 (2003-01-01), Hori
patent: 2004/0178486 (2004-09-01), Maeda
patent: 2004/0195682 (2004-10-01), Kimura
patent: 2005/0013082 (2005-01-01), Kawamoto et al.
patent: 2005/0218503 (2005-10-01), Abe et al.
patent: 8-88464 (1996-04-01), None
patent: 9-27661 (1997-01-01), None

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