Composition of epoxy resin, polyphenolic compound and...

Details Composition of epoxy resin, polyphenolic compound and... Composition of epoxy resin, polyphenolic compound and...

2006-04-25

2008-10-28

Sellers, Robert (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C257S793000, C525S481000, C525S523000

Reexamination Certificate

active

07442729

ABSTRACT:
A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

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