Optical subassembly installing thermistor therein

Details Optical subassembly installing thermistor therein Optical subassembly installing thermistor therein

2006-12-07

2008-08-26

Sanghavi, Hemang (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C257S432000, C257S467000

Reexamination Certificate

active

07416351

ABSTRACT:
The present invention is to provide an optical subassembly with a co-axial package that enables to sense the temperature of the devices mounted within the subassembly with a relatively inexpensive chip thermistor. The subassembly includes a co-axial package and a FPC board to connect the subassembly to the outer circuit. The thermistor is mounted on the FPC board such that one electrode thereof is connected to a pattern formed on a surface opposite to a surface facing the subassembly and the other electrode is soldered to a via hole connecting two surfaces of the FPC board and this via hole is soldered directly to the subassembly.

REFERENCES:
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patent: 6868104 (2005-03-01), Stewart et al.
patent: 7218657 (2007-05-01), Kihara et al.
patent: 2005/0175312 (2005-08-01), Tanaka et al.
patent: 2006/0062526 (2006-03-01), Ikeuchi
patent: 05-243588 (1993-09-01), None

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