Metallic pattern forming method and conductive pattern material

Details Metallic pattern forming method and conductive pattern material Metallic pattern forming method and conductive pattern material

2005-06-01

2008-10-21

Tsoy, Elena (Department: 1792)

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

C427S058000, C427S126100, C427S301000, C427S372200, C427S508000, C427S532000, C427S553000, C427S557000, C427S558000, C427S595000

Reexamination Certificate

active

07438950

ABSTRACT:
The invention provides a metallic pattern forming method comprising: forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide and has a functional group that interacts with either an electroless plating catalyst or a precursor thereof, is generated in a pattern shape; imparting either an electroless plating catalyst or a precursor thereof and electroless plating so as to form a metallic film in the pattern shape, wherein the polyimide has at least one structural unit represented by the following Formula (1) or Formula (2) and has a polymerization initiating site in a skeleton thereof.R1represents a bivalent organic group. R2is represented by one of Formulae (3) to (6).R3, R4, R5and R6independently represents a bivalent organic group.

REFERENCES:
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patent: 2003-046223 (2003-02-01), None
En Tang Kang et al., “Surface Modification of Fluoropolymers via Molecular Design”, Advanced Materials, 2000, vol. 12, No. 20, Oct. 6, pp. 1481-1494.
N. Inagaki et al., “Improved Adhesion between Kapton Film and Copper Metal by Plasma Graft Polymerization of Vinylimidazole”, Macromolecules, 1996, vol. 29, pp. 1642-1648.

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