Polyurethane polishing pad

Details Polyurethane polishing pad Polyurethane polishing pad

2005-01-13

2008-08-19

Cooney, John (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Cellular products or processes of preparing a cellular...

C451S526000, C451S540000, C521S137000, C521S163000, C521S167000, C521S170000, C521S172000, C521S173000, C521S174000, C521S176000

Reexamination Certificate

active

07414080

ABSTRACT:
The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed with an isocyanate-terminated reaction product formed from a prepolymer reaction of a prepolymer polyol and a polyfunctional isocyanate. The isocyanate-terminated section product has 4.5 to 8.7 weight percent unreacted NCO; and the isocyanate-terminated reaction product is cured with a curative agent selected from the group comprising curative polyamines, curative polyols, curative alcoholamines and mixtures thereof. The polishing pad contains at least 0.1 volume percent filler or porosity.

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