Process to reform a plastic packaged integrated circuit die

Details Process to reform a plastic packaged integrated circuit die Process to reform a plastic packaged integrated circuit die

2006-06-05

2008-10-14

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S401100, C029S843000, C174S528000, C257S666000, C438S123000, C438S459000

Reexamination Certificate

active

07434310

ABSTRACT:
A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a bottom surface (240) of an inner portion (230) of the set of leads is exposed at a peripheral region (235) of the inner portion, cutting (310) approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting (320) the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.

REFERENCES:
patent: 5157480 (1992-10-01), McShane et al.
patent: 6350664 (2002-02-01), Haji et al.
patent: 6429028 (2002-08-01), Young
patent: 6548328 (2003-04-01), Sakamoto et al.

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