Semiconductor component having thinned die with conductive...

Details Semiconductor component having thinned die with conductive... Semiconductor component having thinned die with conductive...

2006-01-20

2008-08-26

Lewis, Monica (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S792000, C257SE23116

Reexamination Certificate

active

07417325

ABSTRACT:
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

REFERENCES:
patent: 5071792 (1991-12-01), VanVonno et al.
patent: 5138434 (1992-08-01), Wood et al.
patent: 5229647 (1993-07-01), Gnadinger
patent: 5266912 (1993-11-01), Kledzik
patent: 5436203 (1995-07-01), Lin
patent: 5485039 (1996-01-01), Fujita et al.
patent: 5496775 (1996-03-01), Brooks
patent: 5607875 (1997-03-01), Nishizawa et al.
patent: 5618752 (1997-04-01), Gaul
patent: 5686317 (1997-11-01), Akram et al.
patent: 5789307 (1998-08-01), Igel et al.
patent: 5851911 (1998-12-01), Farnworth
patent: 5863813 (1999-01-01), Dando
patent: 5888883 (1999-03-01), Sasaki et al.
patent: 5893725 (1999-04-01), Bhansali
patent: 5897337 (1999-04-01), Kata et al.
patent: 5904546 (1999-05-01), Wood et al.
patent: 5925936 (1999-07-01), Yamaji
patent: 5933713 (1999-08-01), Farnworth
patent: 5952716 (1999-09-01), Dibble et al.
patent: 6013534 (2000-01-01), Mountain
patent: 6013948 (2000-01-01), Akram et al.
patent: 6020217 (2000-02-01), Kuisi et al.
patent: 6051875 (2000-04-01), Dando
patent: 6054772 (2000-04-01), Mostafazadeh et al.
patent: 6060373 (2000-05-01), Saitoh
patent: 6074896 (2000-06-01), Dando
patent: 6080602 (2000-06-01), Tani et al.
patent: 6087845 (2000-07-01), Wood et al.
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6107109 (2000-08-01), Akram et al.
patent: 6107164 (2000-08-01), Ohuchi
patent: 6114240 (2000-09-01), Akram et al.
patent: 6130111 (2000-10-01), Ikuina et al.
patent: 6136137 (2000-10-01), Farnworth et al.
patent: 6150717 (2000-11-01), Wood et al.
patent: 6153448 (2000-11-01), Takahashi et al.
patent: 6169329 (2001-01-01), Farnworth et al.
patent: 6177295 (2001-01-01), De Samber et al.
patent: 6180504 (2001-01-01), Farnworth
patent: 6221751 (2001-04-01), Chen et al.
patent: 6228678 (2001-05-01), Gilleo et al.
patent: 6233185 (2001-05-01), Beffa et al.
patent: 6281131 (2001-08-01), Gilton et al.
patent: 6294837 (2001-09-01), Akram et al.
patent: 6313531 (2001-11-01), Geisic et al.
patent: 6313651 (2001-11-01), Hembree et al.
patent: 6326698 (2001-12-01), Akram
patent: 6338980 (2002-01-01), Satoh
patent: 6350664 (2002-02-01), Haji et al.
patent: 6353267 (2002-03-01), Ohuchi et al.
patent: 6379999 (2002-04-01), Tanabe
patent: 6432752 (2002-08-01), Farnworth et al.
patent: 6451624 (2002-09-01), Farnworth et al.
patent: 6515371 (2003-02-01), Akiyama et al.
patent: 6524890 (2003-02-01), Ueda et al.
patent: 6534387 (2003-03-01), Shinogi et al.
patent: 6534854 (2003-03-01), Fazelpour et al.
patent: 6544821 (2003-04-01), Akram
patent: 6544902 (2003-04-01), Farnworth
patent: 6549821 (2003-04-01), Farnworth
patent: 6573156 (2003-06-01), Wang et al.
patent: 6579748 (2003-06-01), Okuno et al.
patent: 6589855 (2003-07-01), Miyamoto et al.
patent: 6607970 (2003-08-01), Wakabayashi
patent: 6620731 (2003-09-01), Farnworth et al.
patent: 6649445 (2003-11-01), Qi et al.
patent: 6717245 (2004-04-01), Kinsman et al.
patent: 6774659 (2004-08-01), Chiang
patent: 6803303 (2004-10-01), Hiatt et al.
patent: 6809421 (2004-10-01), Hayasaka et al.
patent: 6828175 (2004-12-01), Wood et al.
patent: 6833613 (2004-12-01), Akram et al.
patent: 6841413 (2005-01-01), Liu
patent: 6903442 (2005-06-01), Wood et al.
patent: 6903443 (2005-06-01), Wood et al.
patent: 6906418 (2005-06-01), Hiatt et al.
patent: 6908784 (2005-06-01), Farnworth
patent: 6911355 (2005-06-01), Farnworth et al.
patent: 6964915 (2005-11-01), Farnworth et al.
patent: 7029949 (2006-04-01), Farnworth et al.
patent: 7081665 (2006-07-01), Wood et al.
patent: 7132731 (2006-11-01), Wood et al.
patent: 7157353 (2007-01-01), Farnworth et al.
patent: 7221059 (2007-05-01), Farnworth et al.
patent: 2001/0040117 (2001-11-01), Easton
patent: 2002/0009826 (2002-01-01), Chien
patent: 2002/0017710 (2002-02-01), Kurashima et al.
patent: 2002/0097302 (2002-07-01), Nikkel
patent: 2005/0168908 (2005-08-01), Maeda et al.
Microchip Fabrication, Peter Van Zant, 2000, McGraw-Hill, Fourth Edition, p. 588.
Advanced Coating Parylene Conformal Coating Specialists, advertising material, pp. 1-7, 1998.
Dexter Electronic Materials, Hysol FP4451 Material Properties, spec sheet, pp. 1-2, Aug. 20, 1999.
Dexter Electronic Materials, Hysol FP 4450 Material Properties, spec sheet, pp. 1-2, Aug. 20, 1999.
Parylene Coating, advertising for Speciality Coating Systems, pp. 1-2, date unknown.
“Wafer size CSP Packaging by VPES”, Japan Rec Co., Ltd., advertising material, pp. 1-4, 1998.
Jeffrey C. Demmin, “More Wafer Thinning at ICAPS”, media news analysis, Mar. 13, 2002.
Zhong L. Wang, Functional and Smart Materials, 1999, Wiley Encyclopedia of Electrical and Electronics Engineering, pp. 1-5, www.mrw.interscience,wiley.com
Ferguson et al., “Moisture Absorption in No-Flow Underfill Materials and its Effect on Interfacial Adhesion to Solder Mask Coated FR4 Printed Wiring Board”, 2001, 2001 International Symposium on Advanced Packaging Materials, pp. 327-332.
Tummala et al., “Microelectronics Packaging Handbook”, 1989, p. 740, Van Nostrand Reinhold, New York, US.

Affiliated with

Also associated with

Rating

Semiconductor component having thinned die with conductive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor component having thinned die with conductive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor component having thinned die with conductive... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4004308