Method of making electrically and thermally enhanced integrated-

Details Method of making electrically and thermally enhanced integrated- Method of making electrically and thermally enhanced integrated-

1994-03-25

1995-09-12

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 522, 437217, H01L 2302

Patent

active

054488257

ABSTRACT:
An encapsulated electrically and thermally enhanced integrated circuit is disclosed. An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate. A lead frame having inwardly-extending bonding fingers has the bottom sides thereof attached to the top of the substrate. A contiguous layer of insulating material is bonded to the top sides of the bonding fingers, such that the layer of insulating material peripherally surrounds the integrated-circuit die. A conductive layer of material is then bonded to the top of the insulating layer. A second layer of insulating material followed by a second conductive layer may be bonded on top of the first conductive layer. Electrical connections are made from the integrated-circuit die to the conductive layers surrounding the die. The device is then encapsulated in a plastic material.

REFERENCES:
patent: 3626259 (1971-12-01), Garboushiam
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4542259 (1985-09-01), Butt
patent: 5159750 (1992-11-01), Dutta et al.

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