Wire guide for a bonding machine

Details Wire guide for a bonding machine Wire guide for a bonding machine

1997-06-12

1999-05-25

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

228 11, 228 45, H01L 21607

Patent

active

059067063

ABSTRACT:
A wire guide is provided for use in a wire bonding machine. The guide can be releasably attached to a bonding wedge and a transducer of the bonding head. The wire guide comprises guide members integrally formed with the wire guide body for feeding the bonding wire to the wedge. Securement means are integrally formed with the guide body for releasably mounting the guide. The securement means are formed such that movement of the guide body with respect to the bonding head allows its release.

REFERENCES:
patent: 4600138 (1986-07-01), Hill
patent: 4786860 (1988-11-01), Zimmerman
patent: 4976392 (1990-12-01), Smith et al.
patent: 5148959 (1992-09-01), Cain et al.
patent: 5190206 (1993-03-01), Miller et al.
patent: 5558270 (1996-09-01), Nachon et al.
patent: 5685476 (1997-11-01), Miyoshi

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