Microelectronic assemblies having compliant layers

Details Microelectronic assemblies having compliant layers Microelectronic assemblies having compliant layers

2006-07-14

2008-08-05

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S781000, C257S777000, C257S787000, C257S773000, C257S759000, C257S642000, C257S760000, C257S784000, C257S780000, C257S776000

Reexamination Certificate

active

07408260

ABSTRACT:
A microelectronic assembly includes a microelectronic element such as a semiconductor chip or wafer having a first surface and contacts accessible at the first surface, a compliant layer overlying the first surface of the microelectronic element, and conductive protrusions overlying the compliant layer and projecting away from the first surface of the microelectronic element, wherein the conductive protrusions are electrically interconnected with the contacts of the microelectronic element. The conductive protrusions are movable relative to said microelectronic element.

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