Pattern alignment method and lithographic apparatus

Details Pattern alignment method and lithographic apparatus Pattern alignment method and lithographic apparatus

2005-12-27

2008-10-07

Rutledge, Della J. (Department: 2851)

Photocopying

Projection printing and copying cameras

Step and repeat

C355S067000, C355S072000, C355S075000, C356S490000, C356S500000

Reexamination Certificate

active

07433018

ABSTRACT:
A method for aligning a substrate in a lithographic apparatus, the method including irradiating a first target portion of the substrate with a first patterned beam to form a first pattern on the substrate. Then, a second target portion of the substrate is irradiated with a second pattern beam to form a second pattern on the substrate. The second target portion at least partly overlaps the first target portion. A diffraction beam is detected during irradiation of the second pattern, due to a diffraction of the second patterned beam on the first pattern. The diffraction beam is compared with a desired diffraction beam, and the substrate is aligned based on a comparison between the detected diffraction beam and the desired diffraction beam.

REFERENCES:
patent: 5160848 (1992-11-01), Saitoh et al.
patent: 6772084 (2004-08-01), Bischoff et al.
patent: 2005/0123844 (2005-06-01), Monshouwer
patent: 2007/0127025 (2007-06-01), Abdulhalim et al.

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