Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-01-23
2008-08-19
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C361S703000, C361S709000, C361S710000, C165S104330, C165S185000, C174S015200, C174S016300
Reexamination Certificate
active
07414848
ABSTRACT:
A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat conducting portions and located between the heat conducting portions, and a plurality of second fins extending outwardly from second faces of the heat conducting portions. Two heat pipes connect the base and the two heat sinks. Each heat pipe includes a first section thermally engaged with the base, and two second sections extending from the base and thermally engaged with the heat conducting portion of a corresponding heat sink. The second sections are located outside a hub and below fan blades of an impeller of a fan mounted on the heat sinks.
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Chen Chun-Chi
Liu Peng
Zhou Shi-Wen
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Gandhi Jayprakash N
Hoffberg Robert J
Niranjan Frank R.
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