Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-04-05
2008-08-05
Kebede, Brook (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S684000, C257SE23188, C257SE23193
Reexamination Certificate
active
07408250
ABSTRACT:
A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive material comprising a compliant adhesive component is applied and positioned between the device substrate and package substrate.
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Doan Jonathan
Tarn Terry
Brady III Wade James
Kebede Brook
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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