Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-10-05
2008-10-07
Nguyen, Dao H (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S666000, C257S690000, C257S777000, C257SE23037, C257SE23052, C438S106000, C438S109000
Reexamination Certificate
active
07432588
ABSTRACT:
A semiconductor device100comprises a leadframe104having an island portion102; two chips of a first semiconductor chip110and a second semiconductor chip120, respectively having top surfaces having, in the peripheral areas thereof, pad portions respectively having a plurality of first bonding pads112and second bonding pads122arranged therein and a back surface, being placed respectively on both surfaces of the island portion102of the leadframe104so as to oppose the back surface sides thereof to the island portion102; and a mold resin150molding two these first semiconductor chip110and second semiconductor chip120, wherein two these first semiconductor chip110and second semiconductor chip120have nearly same configurations of the pad portions; and two these semiconductor chips are arranged so as to shift the pad portions from each other.
REFERENCES:
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6750080 (2004-06-01), Masuda et al.
patent: 07-335826 (1995-12-01), None
patent: 08-330508 (1996-12-01), None
patent: 2001-358285 (2001-12-01), None
NEC Electronics Corporation
Nguyen Dao H
Young & Thompson
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