Thermoelectric cooling device arrays

Details Thermoelectric cooling device arrays Thermoelectric cooling device arrays

2006-11-17

2008-10-14

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000

Reexamination Certificate

active

07436059

ABSTRACT:
In various embodiments, a TEC device array may be coupled to a chip and a heat sink to cool the chip. The TEC device array may include multiple TEC devices separately controlled to provide different cooling rates at different points in the TEC device array coupled to the chip. In some embodiments, temperature data for areas on the chip or for separate electronic components may be determined using one or more thermal sensors and then sent to a controller. The controller may then determine an appropriate response for the TEC devices in the TEC device array near the area of the thermal sensor(s). The controller may thus control the cooling rates (which may be different) of several TEC devices in the TEC device array.

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