Method of making circuitized substrate with split conductive...

Details Method of making circuitized substrate with split conductive... Method of making circuitized substrate with split conductive...

2006-12-20

2008-05-27

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S850000, C029S858000

Reexamination Certificate

active

07377033

ABSTRACT:
A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. An information handling system, e.g., a mainframe computer, which represents one of the products in which the substrate may be utilized, is also provided.

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