Photosensitive resin composition

Details Photosensitive resin composition Photosensitive resin composition

2007-06-13

2008-09-16

Berman, Susan W (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S014000, C522S039000, C522S120000, C522S121000, C522S017000, C522S012000, C522S016000, C430S281100

Reexamination Certificate

active

07425585

ABSTRACT:
Photosensitive compositions which can be developed by alkali solution, comprise(A) a polymer containing at least one carboxylic acid group in the molecule and having a molecular weight of 200,000 or less,(B) selected α-aminoalkylphenone compounds as photoinitiators and(C) an ester of a polyol, wherein the polyol is partially or fully esterified with an ethylenically unsaturated carboxylic acid a monomeric, oligomeric or polymeric compound having at least one olefinic double bond.

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patent: 2004/0265730 (2004-12-01), Takahashi et al.
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Derwent Abstract 1992-245718 for JP 04164901 (1992).
Derwent Abstract 2001-061115 [07] for WO 00/68740.
Derwent Abstract 2000-045318/04 for JP 11306964 (1999).
Derwent Abstract 1999-381501 for JP 11149862 (1999).
Derwent Abstract 99-249656/21 for JP 11072909 (1999).
Derwent Abstract 99-236642/20 for JP 11065102 (1999).

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