System and method for cooling a module

Details System and method for cooling a module System and method for cooling a module

2006-04-11

2008-05-20

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S712000, C361S718000, C361S719000, C165S080300, C165S104330, C165S185000, C257S718000, C257S719000, C257S727000, C174S252000

Reexamination Certificate

active

07375963

ABSTRACT:
Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

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U.S. Appl. No. 11/201,972, filed Aug. 11, 2005, Colbert, et al., “Method and Apparatus for Mounting a Heat Sink in Thermal Contact With an Electronic Component”.

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