Method of manufacturing semiconductor device and method of...

Details Method of manufacturing semiconductor device and method of... Method of manufacturing semiconductor device and method of...

2004-04-28

2008-05-13

Pham, Thanhha S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S113000, C438S430000, C257SE21499

Reexamination Certificate

active

07371607

ABSTRACT:
A method of manufacturing a semiconductor device includes mounting a first semiconductor chip on each partitioned region of a frame substrate partitioned for each first semiconductor package; mounting a second semiconductor package, where a second semiconductor chip is mounted, on each partitioned region of the frame substrate so as to be arranged above the first semiconductor chip; and cutting the frame substrate, where the second semiconductor package is mounted, for each partitioned region of the frame substrate.

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