Inkjet printheads

Etching a substrate: processes – Forming or treating thermal ink jet article

Reexamination Certificate

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Reexamination Certificate

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07429336

ABSTRACT:
A method of making an inkjet printhead comprising providing a substrate having first and second opposite surfaces, providing a support member, bonding the second surface of the substrate to the support member, and, after the substrate and support member are bonded together, forming a plurality of ink ejection elements on the first surface of the substrate, the method further including forming communicating ink supply slots passing respectively through the substrate and support member to provide fluid communication between an ink supply and the ink ejection elements.

REFERENCES:
patent: 4894664 (1990-01-01), Tsung Pan
patent: 5818516 (1998-10-01), Rezanka
patent: 6007176 (1999-12-01), Powers et al.
patent: 6280013 (2001-08-01), Courian et al.
patent: 6766817 (2004-07-01), Da Silva
patent: 6902867 (2005-06-01), Hall et al.
patent: 0 352 726 (1990-01-01), None
Kneezel, G.A. et al., “Corrosion-Resistant Heat Sinking Substrate For Thermal Ink Jet Printheads,” Xerox Disclosure Journal, Xerox Corporation, US, vol. 22, No. 6, (Nov. 1, 1997).
EP 03 10 3539, “Search Report”, Feb. 4, 2004.

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