Thermal head and manufacturing method thereof

Details Thermal head and manufacturing method thereof Thermal head and manufacturing method thereof

2006-05-17

2008-05-13

Feggins, K. (Department: 2861)

Incremental printing of symbolic information

Thermal marking apparatus or processes

Specific resistance recording element type

Reexamination Certificate

active

07372477

ABSTRACT:
A method for manufacturing a thermal head is provided which includes the steps of forming a resistor layer and an insulating barrier layer, patterning the above two layers to form aligned heating resistors, forming a solid electrode layer over the heating resistors and the like, and partly removing the solid electrode layer to form opening portions and electrode layers for supplying electricity to the heating resistors. In the patterning step, part of the resistor layer and part of the insulating barrier layer, which are outside a heat generating area, are simultaneously removed to form the heating resistors having a planar U shape composed of a pair of effective heating portions and a connection portion connecting the above pair, the effective heating portions and the connection portion each having a predetermined length and width. The length of the connection portion is set to 5 μm or less.

REFERENCES:
patent: 5477266 (1995-12-01), Shirakawa
patent: 6151054 (2000-11-01), Shimizu
patent: 6304280 (2001-10-01), Yamade et al.
patent: A1 2004-017523 (2004-01-01), None
patent: A2 2004-155160 (2004-06-01), None

Affiliated with

Also associated with

Rating

Thermal head and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal head and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal head and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3984207