Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-10-24
2008-05-20
Potter, Roy Karl (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C438S108000
Reexamination Certificate
active
07375427
ABSTRACT:
A semiconductor device including a semiconductor element, an electrode pad formed on the semiconductor element, and a bump electrode conductively connected to the electrode pad which includes a resin bump formed on an active face of the semiconductor element and a conductive layer provided from the electrode pad to the surface of the resin bump, the conductive layer and the resin bump being arranged without adhesion.
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Potter Roy Karl
Seiko Epson Corporation
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