Method of making circuitized substrate assembly

Details Method of making circuitized substrate assembly Method of making circuitized substrate assembly

2006-02-09

2008-03-18

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S831000, C029S846000, C029S852000

Reexamination Certificate

active

07343674

ABSTRACT:
A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is placed over one of the openings and a quantity of conductive paste is positioned thereon prior to bonding the substrates. At least some of the paste is then forced up into an opening in the other substrate as a result of the bonding.

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IBM TDB, “Automatic Method For Registration And Stacking of Laminates”, by Hollis.
IBM TDB, “Multilayer Subsurface Circuit Board Constructions”, by Mace.

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