Phenol-reacted non-ester alicyclic diepoxides

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From heterocyclic reactant containing as ring atoms oxygen,...

Reexamination Certificate

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Details

C525S523000, C525S524000, C525S529000, C525S531000

Reexamination Certificate

active

07345140

ABSTRACT:
The present invention provides a non-ester type epoxy resin having a low hydrolytic chlorine content and containing no ester bond that is easily hydrolyzed, and a resin composition containing the non-ester type epoxy resin as an essential ingredient. Using the non-ester type epoxy resin, a resin composition having a low chlorine content and also having low water absorption and acid value is obtained. The resin composition is useful as a curable resin composition for a material in an electronics.

REFERENCES:
patent: 3547872 (1970-12-01), Weissermel et al.
patent: 6160077 (2000-12-01), Bayer et al.
patent: 2006/0009547 (2006-01-01), Maeshima et al.
patent: 1005732 (1965-09-01), None
patent: 11-263827 (1999-09-01), None
HCAPLUS accession No. 1982:218684 for the Plasticheskie Massy article by Pet'ko et al., vol. 4, 1982, abstract, two pages.
HCAPLUS accession No. 1982:492044 for the Deposited Doc. article by Batog et al., 1980, three pages.
HCAPLUS accession No. 1994:193852 and Derwent accession No. 1993-301471 for Soviet Union Patent No. 1,763,455, Onishchenko et al., Sep. 23, 1992, three pages.
Derwent accession No. 2004-399859 for U.S. Publication No. 2006/0009547, Maeshima et al., Jan. 12, 2006, equivalent to PCT Publication No. WO 2004/035558 A1, Apr. 29, 2004, one page.
Cover sheet for PCT Publication No. WO 2004/035558 A1, Maeshima et al., Apr. 29, 2004 of PCT Application No. PCT/JP2003/011287, Sep. 4, 2003, one page.

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