Printed wiring board and fabrication method for printed...

Details Printed wiring board and fabrication method for printed... Printed wiring board and fabrication method for printed...

2006-09-08

2008-09-09

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S760000

Reexamination Certificate

active

07423221

ABSTRACT:
A printed wiring board on which a pattern can be formed favorably by printing and soldering even where a small part of the1005size or less is mounted. The printed wiring board includes a substrate; a pair of soldering lands on the substrate, the soldering lands being spaced from one another with a first side of one land opposing a first side of another land; and a mounted part having a pair of electrodes on opposite ends thereof soldered to the respective lands. A wiring line is connected to each soldering land, and an insulating element overlies the wiring lines. The insulating element has openings formed so as to expose the soldering lands therethrough. Wiring line connection elements are individually connected to only the first sides of the lands. Each insulating element opening has an edge positioned outside of the corresponding land and on the inner side of the corresponding wiring line connection element.

REFERENCES:
patent: 5897326 (1999-04-01), Eldridge et al.
patent: 6424400 (2002-07-01), Kawasaki
patent: 6608259 (2003-08-01), Norskov
patent: 2004/0112633 (2004-06-01), Endo et al.
patent: 2007/0114057 (2007-05-01), Matsuda
patent: 10 2004 017455 (2005-03-01), None
patent: 2001-168506 (2001-06-01), None
patent: 2003-031937 (2003-01-01), None
patent: 2003-249747 (2003-09-01), None
patent: 2004-022793 (2004-01-01), None

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