Semiconductor device having an electronic circuit disposed...

Details Semiconductor device having an electronic circuit disposed... Semiconductor device having an electronic circuit disposed...

2006-09-22

2008-09-30

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S678000, C257S685000, C257S700000, C257S738000, C257S758000, C257S759000, C257S760000, C257S778000

Reexamination Certificate

active

07429793

ABSTRACT:
A semiconductor device and a fabrication method thereof are provided. A semiconductor device which is packaged as it includes a semiconductor in which an electronic circuit is disposed, the semiconductor device including: a substrate; a semiconductor chip which has a semiconductor main body having the electronic circuit formed thereon, a pad electrode formed on the semiconductor main body and a projected electrode that is connected to the pad electrode and projected from a surface of the semiconductor main body, wherein the semiconductor chip is mounted on the substrate from the back side of the surface to form the projected electrode thereon; and an insulating layer which is formed as the semiconductor chip buried therein and is polished from a top surface of the insulating layer to a height at which a top of the projected electrode is exposed.

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