Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-08-02
2008-07-22
Reichard, Dean A. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S262000, C361S790000, C361S792000, C361S795000
Reexamination Certificate
active
07402760
ABSTRACT:
A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core substrate has a throughhole opening, and the throughhole structure is formed in the throughhole opening. The first interlayer insulation layer is formed over the core substrate. The first via is formed in the first interlayer insulation layer and has a bottom portion having a first radius. The second interlayer insulation layer is formed over the first interlayer insulation layer and the first via. The second via is formed in the second interlayer insulation layer and has a bottom portion having a second radius greater than the first radius. The first via is positioned inside a circle having a radius (D1) from a gravity center of the throughhole opening, and the radius (D1) of the circle satisfies a formula, (D1)=(R)+(r)/3, where (R) represents a radius of the throughhole opening and (r) represents the first radius of the first via.
REFERENCES:
patent: 5590461 (1997-01-01), Ishida
patent: 5713127 (1998-02-01), Chobot et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 5875102 (1999-02-01), Barrow
patent: 6078013 (2000-06-01), Stack
patent: 6487088 (2002-11-01), Asai et al.
patent: 6591491 (2003-07-01), Fujii et al.
patent: 7091424 (2006-08-01), Oggioni et al.
patent: 7102085 (2006-09-01), Ohta et al.
patent: 7262975 (2007-08-01), Kariya et al.
patent: 7339118 (2008-03-01), Takada et al.
patent: 2005/0126818 (2005-06-01), Kojima et al.
patent: 2005/0236177 (2005-10-01), Inagaki et al.
patent: 2006/0231290 (2006-10-01), Kariya et al.
patent: 2007/0151758 (2007-07-01), Dunn et al.
patent: 2008/0055872 (2008-03-01), Inagaki et al.
patent: 2001-044640 (2001-02-01), None
patent: 2001-127435 (2001-05-01), None
patent: 2002-094240 (2002-03-01), None
patent: 2002-208778 (2002-07-01), None
patent: 2003-152311 (2003-05-01), None
U.S. Appl. No. 11/832,892, filed Aug. 2, 2007, Wu.
U.S. Appl. No. 11/832,673, filed Aug. 2, 2007, Wu.
IBIDEN Co., Ltd.
Nguyen Hoa C
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Reichard Dean A.
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