Substrate, manufacturing method therefor, and semiconductor...

Details Substrate, manufacturing method therefor, and semiconductor... Substrate, manufacturing method therefor, and semiconductor...

2005-01-24

2008-03-11

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S458000

Reexamination Certificate

active

07341923

ABSTRACT:
A step of forming the first substrate which has a separation layer and a Ge layer on the separation layer, and a step of forming a bonded substrate stack by bonding the first substrate to the second substrate through an insulating layer, and a step of dividing the bonded substrate stack at the separation layer are performed, thereby obtaining a substrate with a GOI structure.

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