Method for forming a back-drilled plated through hole in a...

Details Method for forming a back-drilled plated through hole in a... Method for forming a back-drilled plated through hole in a...

2006-02-15

2008-03-04

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C427S097100, C427S097200

Reexamination Certificate

active

07337537

ABSTRACT:
A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit board includes a via extending through a plurality of stacked layers. The via includes a plated through hole and a back-drilled hole. The plated through hole is located within a predetermined number of the stacked layers and the back-drilled hole is located within the remaining stacked layer(s). The plated through hole without an electrically conductive material located on walls therein has a diameter that is substantially the same size or smaller than the diameter of the back-drilled hole.

REFERENCES:
patent: 4543715 (1985-10-01), Iadarola et al.
patent: 5576519 (1996-11-01), Swamy
patent: 6722031 (2004-04-01), Japp et al.
patent: 6802120 (2004-10-01), Uehara

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