Heat dissipation structure of intelligent power module,...

Details Heat dissipation structure of intelligent power module,... Heat dissipation structure of intelligent power module,...

2006-01-13

2008-03-25

Gandhi, Jayprakash (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S709000, C361S719000, C165S104330, C165S185000, C174S016300

Reexamination Certificate

active

07349214

ABSTRACT:
A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.

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patent: 2000338904 (2000-12-01), None
patent: 2003093750 (2003-12-01), None
patent: 10-2006-0066539 (2006-06-01), None
Korean Office action for Korean patent application No. 2005-0003980 issued on Aug. 28, 2006.

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