Semiconductor wafer positioning method, and apparatus using...

Details Semiconductor wafer positioning method, and apparatus using... Semiconductor wafer positioning method, and apparatus using...

2005-12-08

2008-03-18

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S213000, C438S401000, C414S936000

Reexamination Certificate

active

07346415

ABSTRACT:
The intensity of light of a predetermined wavelength corresponding to the type of a protective tape joined to the surface of a semiconductor wafer is adjusted by a controller, and a holding stage for holding the semiconductor wafer is scanned rotationally. At this time, at a V notch portion for positioning formed in the semiconductor wafer, light is transmitted through the protective sheet covering the surface, which is received by a photoreception sensor. Based on the change in the reception amount of light in the photoreception sensor, the position of a detection site is specified.

REFERENCES:
patent: 5644400 (1997-07-01), Mundt
patent: 5822213 (1998-10-01), Huynh
patent: 8-279547 (1996-10-01), None
patent: 2003-258062 (2003-09-01), None

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