Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2006-03-30
2008-03-25
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S724000
Reexamination Certificate
active
07348668
ABSTRACT:
A memory card containing a resin sealed stacking of plural semiconductor chips which are rear surface mounted over a main surface of a base substrate, the rear surface of the substrate being provided with external connection terminals. The relatively lower ones of the stacked semiconductor chips include a memory circuit and may be larger in size than the uppermost chip which contains a control circuit. Resin sealed wiring connections between bonding pads on the main surface of the respective chips and corresponding ones of electrodes on the main surface of the substrate are arranged so as to avoid crossovers between them, with respect to a plan view thereof. A resin cap may be used to cover the main surface side of the base substrate, which has the resin sealed semiconductor chips mounted thereon.
REFERENCES:
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5239447 (1993-08-01), Cotues et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5780925 (1998-07-01), Cipolla et al.
patent: 5963794 (1999-10-01), Fogal et al.
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6084308 (2000-07-01), Kelkar et al.
patent: 6252305 (2001-06-01), Lin et al.
patent: 6381143 (2002-04-01), Nakamura
patent: 6410987 (2002-06-01), Kanemoto et al.
patent: 6538331 (2003-03-01), Masuda et al.
patent: 6621155 (2003-09-01), Perino et al.
patent: 6686663 (2004-02-01), Masuda et al.
patent: 7061105 (2006-06-01), Masuda et al.
patent: 2001/0009595 (2001-07-01), Mishizawa et al.
patent: 04-199566 (1992-07-01), None
patent: 04-302164 (1992-10-01), None
patent: 11-204720 (1999-07-01), None
Masuda Masachika
Usami Toshihiko
Antonelli, Terry Stout & Kraus, LLP.
Clark S. V.
Elpida Memory Inc.
LandOfFree
Semiconductor device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3964669