Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2004-09-22
2008-03-11
Phan, Tim (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S829000, C029S830000, C029S831000, C029S832000, C029S841000, C029S846000, C228S124100, C228S206000, C228S245000, C257SE23006, C257SE23106, C438S107000, C438S108000
Reexamination Certificate
active
07340828
ABSTRACT:
There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. A molten metal is caused to contact both sides of a ceramic substrate10to be cooled and solidified. Thus, a circuit forming metal plate12having a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate10, and a metal base plate14is bonded to the other side thereof.
REFERENCES:
patent: 4884170 (1989-11-01), Ohki et al.
patent: 2002/0050510 (2002-05-01), Osanai et al.
patent: 2002-76551 (2002-03-01), None
Ibaraki Susumu
Namioka Makoto
Osanai Hideyo
Bachman & LaPointe
Dowa Mining Co. Ltd.
Phan Tim
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