Method for thermal testing and compensation of integrated circui

Electric heating – Metal heating – By arc

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219121LB, 219209, B23K 2600

Patent

active

042848725

ABSTRACT:
Apparatus and method for compensating thermal drift of temperature sensitive circuitry in an integrated circuit by heating the temperature sensitive circuitry by applying power to a heating element in the integrated circuit, testing the temperature sensitive circuitry, and trimming a thin film resistor in accordance with the testing results. The heating element is an integrated resistor adjacent to or surrounding the temperature sensitive circuitry. The integrated circuit further includes a thin film compensation resistor which affects or determines the degree of temperature sensitivity of the temperature sensitive circuitry. As the temperature of the temperature sensitive circuitry is increased, testing apparatus is utilized to measure a temperature sensitive parameter of the temperature sensitive circuitry. Control signals indicative of the amount of required trimming of the thin film compensation resistor are produced in response to the testing to adequately compensate the thermal drift of the temperature sensitive circuitry. The control signals are utilized to control the operations of a laser which precisely trims the thin film compensating resistor by the required amount.

REFERENCES:
patent: 3395265 (1968-07-01), Weir
patent: 3768157 (1973-10-01), Buie
patent: 3842495 (1974-10-01), Bennett et al.
patent: 3887785 (1975-06-01), Alphort
patent: 3947801 (1976-03-01), Bube
patent: 4050126 (1977-09-01), Ikeno et al.
Journal of the Society of Precision Engineering; (Japan) vol. 42, No. 6, Jun. 1976, pp. 501-506; "Automated Laser Trimming System for Thin Film Hybrid IC" by Nakayama et al.
Microelectronics; vol. 6, No. 1, Sep. 1974, pp. 39-50; "Design of Temperature-Controlled Substrates for Hybrid Microcircuits" by Greenhouse et al.

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